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Surface Mount &BGA Assembly

  • Surface Mount &BGA Assembly
  • Surface Mount &BGA Assembly
  • Surface Mount &BGA Assembly

Surface Mount &BGA Assembly

    Unit Price: 19.9 USD
    Min. Order: 1 Piece/Pieces
    Packaging: Vacuum packing
    Transportation: Ocean,Land,Air,Express,Others
    Supply Ability: shenzhen
    Port: shenzhen

Product Description

What is BGA assembly?

(1) In the work of Surface-Mount (SMT) & BGA Assembly, it is also very important for the viscosity of the flux used for SMT to be very high. Too high will affect the coating and transfer; too low will affect the amount of coating. Generally, the viscosity should be selected in the range of (25000±5000)cp.

(2) The thickness of the flux is 60% of the solder ball. If it is too thick, it is easy to be smeared on the package body, causing vibration during soldering, and even optical centering recognition.

(3) Detection method. Generally, a saw tooth ruler can be used for detection, but this saw tooth ruler may have a height difference from the actual BGA chip solder ball due to factors such as sampling position, operation method (immersion speed, time), and saw tooth size.

Glass paste should be used for observation. A good solder height should obtain a uniform solder pattern under the glass plate, and the size should be at least larger than the solder ball. The device that rotates and smoothes the flux often obtains a different amount of flux due to the difference in viscosity. Using X-rays to observe the size of the solder joints, it is found that the thicker the flux, the larger the diameter of the solder joint, indicating that the amount of flux affects the degree of collapse of the solder joint. Tests show that the coating thickness should reach 60% of the diameter of the solder ball
(4) BGA packages should use large-size balls to eliminate bridging caused by the sealing effect after excessive flux.

(5) The source of the formation process of solder joints and the video of PCB reflow soldering process. When the ML-PoP is heated above the melting point of the solder joint, the BGA solder ball and the PoP solder ball will melt and fuse successively.

The early fusion will be drawn into a columnar or waist shape, and then as most of the solder joints are fused, the Surface-Mount (SMT) & BGA Assembly will fall.

From this process, the melting and fusion process of the BGA solder ball and the PoP solder ball is gradually completed. As long as there is flux on the BGA solder ball, the BGA solder ball and the PoP solder ball will fuse and will not form a ball socket; If there is no flux on the ball, a ball socket will be formed.

If there is flux on the bottom surface of the SMT & BGA Assembly, it will cause the BGA to vibrate up and down on the PoP. This vibration is beneficial to eliminate the discharge of gas inside and outside the fusion solder joints and the disconnection of the bridge solder joints in smt patch processing, and has the effect of eliminating bridging. PoP has never been bridging due to excessive flux, but excessive flux will affect the placement of a Surface-Mount & BGA Assembly. When the Surface-Mount & BGA Assembly is wetted with flux, the nozzle of the placement machine cannot absorb the components, and it also affects the pattern recognition

Surface Mount Smt Bga Assembly JpgSurface Mount Technology Assembly JpgSmt Bga Assembly Jpg

HAODA ELECTRONIC CO.,LIMITED

 HAODA ELECTRONIC CO.,LIMITED specializes in high-speed turn-key PCB services:PCB design, PCB Fabrication, PCBA and Components Sourcing, we provide services for about 4000 customers around the world. HAODA ELECTRONIC CO.,LIMITED is a local factory focused on the "multiple species, short delivery time, rapid prototype" PCB manufacturers in Shenzhen . Company Had accumulated plenty of advantages over the years in PCB prototype, PCB mass production , with the help of many years of experience in the PCB industry and technology precipitation, the company reputation continues to improve, product quality has been recognized by different type customers all over the world...

We can serve you:

  • 0-18Layer FR4 board:

1 layer LED Based Night Lamp
4 Layer Power line Circuits
6 Layer Laser Circuits
8 Layer Button Motor Controller Circuits
12 Layer Touch Activated Switch Circuits

  • Quick Turn PCB:

12 hours for 2 layer PCB
24 hours for 4 layer PCB
48 hours for 6layer PCB


  • High Frequency Board

Roger 4003 printed board
Roger 4350 printed board
ceramics base copper-clad laminates
mulit-wiring printed board
industrial control PCB

HDI PCB
BVH(buried/blind via hole)PCB
Ro4350B+FR4 hybrid Board
Flame resistant PCB
Metal Core PCB (MCPCB)
  • Rigid-Flex Board

6 layer Rigid-flex Immersion Gold PCB
BVH(buried/blind via hole)PCB
Characteristic impedance CPB
Flame resistant PCB
Metal Core PCB (MCPCB)

  • Aluminum Base Board

Aluminum 2.0W LED board
Aluminum 3.0W LED board
communication PCB
Aluminum base board
Aluminum LED board

  • PCB Assembly Products

Through-Hole Assembly
Turkey PCB Assembly
PCBA Manufacturing
Surface-Mount (SMT) &BGA Assembly
Box Build Assembly
Mixed Assembly

  • PCBA Components Sourcing

Parting Sourcing
Electronic Components
Electronic connectors
Cable Connectors I/O Connectors
originality electronics IC
Electronic Resistor and Capacitor




Company Info

  • Company Name: HAODA ELECTRONIC CO.,LIMITED
  • Representative: Gansu QingYang
  • Product/Service: PCB , PCBA , PCB assembly , Quick Turn PCB , High frequency board , Rigid-Flex Board
  • Capital (Million US $): 1000,000RMB
  • Year Established: 2015
  • Total Annual Sales Volume (Million US $): US$50 Million - US$100 Million
  • Export Percentage: 91% - 100%
  • Total Annual Purchase Volume (Million US $): Below US$1 Million
  • No. of Production Lines: 21
  • No. of R&D Staff: 11 -20 People
  • No. of QC Staff: 51 -60 People
  • OEM Services Provided: yes
  • Factory Size (Sq.meters): 50,000-100,000 square meters
  • Factory Location: Building 2, Gangbei Industrial Zone, Huangtian, Hangcheng Street, Baoan District, Shenzhen
  • Contact Person: Mr. Gan QingYang
  • Tel: +86-0755-23720053
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